Semiconductor device having interconnection in package and method for manufacturing the same

ABSTRACT

A semiconductor device includes a first die connected to a first channel, the first die comprising a first memory chip; and a second die connected to a second channel, the second die comprising a second memory chip, the first and second channels being independent of each other and a storage capacity and a physical size of the second die being the same as those of the first die. The first and second dies are disposed in one package, and the package includes an interconnection circuit disposed between the first die and the second die to transfer signals between the first memory chip and the second memory chip.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application claims priority to and is a continuation application ofU.S. patent application Ser. No. 16/734,821, filed Jan. 6, 2020, whichis a continuation application of U.S. patent application Ser. No.16/527,415, filed Jul. 31, 2019, which is a continuation application ofU.S. patent application Ser. No. 15/640,854, filed Jul. 3, 2017, whichis a continuation application of U.S. patent application Ser. No.14/697,634, filed Apr. 28, 2015, which claims priority under 35 U.S.C. §119 to Korean Patent Application No. 10-2014-0086185 filed Jul. 9, 2014,in the Korean Intellectual Property Office, the entire contents of eachof which are hereby incorporated by reference.

BACKGROUND

The embodiments described herein relate to a semiconductor device, andmore particularly, relate to a semiconductor device accessed in packageusing an independent channel.

A processing system may contain a multi-channel memory device thatindependently operate in one package through different channels.

A multi-channel semiconductor device formed of a volatile memory (e.g.,DRAM) is typically integrated on one die (or, chip) and is thencontained in one package. The multi-channel semiconductor device isconnected to a corresponding processor and independently conducts datareading and writing operations through respective channels.

When the multi-channel semiconductor device is implemented on a mono die(e.g., a single, integrated die), the size of the die markedly increasesdue to two or more channels formed on the mono die, thereby loweringdensity and availability on edge dies. As such, production cost mayincrease due to a decrease in yield.

SUMMARY

According to certain aspects of the disclosed embodiments, asemiconductor device includes a first die connected to a first channel,the first die comprising a first memory chip; and a second die connectedto a second channel, the second die comprising a second memory chip, thefirst and second channels being independent of each other and a storagecapacity and a physical size of the second die being the same as thoseof the first die. The first and second dies are disposed in one package,and the package includes an interconnection circuit disposed between thefirst die and the second die to transfer signals between the firstmemory chip and the second memory chip.

In one embodiment, the first channel is a channel dedicated to the firstmemory chip for receiving a first type of signal from outside thesemiconductor device, the second channel is a channel dedicated to thesecond memory chip for receiving the first type of signal from outsidethe semiconductor device, and the interconnection circuit comprises acommon channel shared by the first and second memory chips for receivinga second type of signal different from the first type of signal at oneof the first and second memory chips and applying the second type ofsignal to both the first memory chip and the second memory chip.

In one embodiment, the first type of signal is an address, data, orcommand signal, the second type of signal is an operational controlsignal that includes one of an impedance calibration signal and a resetsignal.

The package may include a package substrate on which the first die andsecond die are mounted, and the first die and second die may be mountedto be at a same vertical level above the package substrate.

In one embodiment, the interconnection circuit is included within thepackage substrate.

In one embodiment, the first and second dies are disposed to have aspace therebetween, and at least a part of the interconnection circuitis formed between the first and second dies.

In one embodiment, the first and second dies are positioned to have sideedges that are aligned with each other.

In one embodiment, the first and second dies are disposed in the packageand are arranged in a mirror die configuration.

In one embodiment, the first and second dies are disposed in the packageand are arranged in a rotated die configuration.

In one embodiment, the first die includes a first swapping circuitconfigured to change a signal order of signals received at die pads ofthe first die in response to a swapping enable signal.

In one embodiment, the second die includes a second swapping circuitconfigured to change a signal order of signals received at die pads ofthe second die in response to the swapping enable signal.

In one embodiment, the second swapping circuit is enabled in response tothe swapping enable signal when the first swapping circuit is disabled.

In one embodiment, the semiconductor device further includes a third dieconnected to a third channel, the third die comprising a third memorychip, and a fourth die connected to a fourth channel, the fourth diecomprising a fourth memory chip, the third and fourth channels beingindependent of each other and a storage capacity and a physical size ofthe fourth die being the same as those of the third die The first tofourth dies may be disposed in the one package. The package may includean additional interconnection part disposed between the third die andthe fourth die to transfer signals between the third memory chip and thefourth memory chip.

In one embodiment, the first and second dies conduct the same memoryoperations as a 2-channel mono die DRAM having a size of the combinedfirst and second dies.

According to some aspects of the disclosed embodiments, a semiconductordevice includes: a first die connected to a first channel through whichan address, a command, and data are received; and a second die connectedto a second channel independent of the first channel through which anaddress, a command, and data are received. A data storage capacity and aphysical size of the second die are the same as those of the first die.The first and second dies are disposed on a package substrate as part ofa package, and are horizontally spaced apart from each other to includea space therebetween. The package includes an interconnection circuitdisposed between the first die and the second die to transfer a commonsignal, associated with a memory operation, between the first die andthe second die.

In one embodiment, the semiconductor device has the same memoryoperation as a DDR DRAM with a 2-channel mono die configuration.

In one embodiment, the common signal is a reset signal or an impedancecalibration signal.

In one embodiment, the first channel is a channel dedicated to the firstdie for receiving the address, command, and data from outside thesemiconductor device; the second channel is a channel dedicated to thesecond die for receiving the address, command, and data from outside thesemiconductor device; and the common signal is a signal used by both thefirst die and the second die.

According to certain aspects of the disclosed embodiments, asemiconductor device includes: a package substrate; a firstsemiconductor memory chip on the substrate; a second semiconductormemory chip on the substrate and horizontally separated from the firstsemiconductor memory chip so that a space is formed between a first edgeof the first semiconductor memory chip and a first edge of the secondsemiconductor chip; a first set of pads on the first semiconductor chipconnected to a first channel dedicated to the first semiconductor chip;a second set of pads on the second semiconductor chip connected to asecond channel dedicated to the second semiconductor chip; a third setof pads on the first semiconductor chip connected to an interconnectioncircuit on the package substrate; and a fourth set of pads on the secondsemiconductor chip connected to the interconnection circuit. Theinterconnection circuit transfers certain signals received from andprocessed at the first semiconductor chip to the second semiconductorchip.

In one embodiment, the first semiconductor chip receives a first type ofsignal over the first channel; the second semiconductor chip receivesthe first type of signal over the second channel; and the certainsignals transferred by the interconnection circuit are second type ofsignal different from the first type of signal.

BRIEF DESCRIPTION OF THE FIGURES

The above and other objects and features will become apparent from thefollowing description with reference to the following figures, whereinlike reference numerals refer to like parts throughout the variousfigures unless otherwise specified, and wherein:

FIG. 1 is a block diagram of a memory system according to an embodimentof the inventive concept;

FIG. 2 is a block diagram schematically illustrating a semiconductordevice shown in FIG. 1, according to one embodiment of the inventiveconcept;

FIG. 3 is a block diagram schematically illustrating of a storage deviceaccording to another embodiment of the inventive concept;

FIG. 4 is a block diagram schematically illustrating of a storage deviceaccording to still another embodiment of the inventive concept;

FIG. 5 is a diagram showing a connection structure among die pads of asemiconductor device shown in FIG. 2, according to one embodiment of theinventive concept;

FIG. 6 is a block diagram for describing how output signals of FIG. 5are swapped, according to one embodiment of the inventive concept;

FIG. 7 is a block diagram for describing how column addresses of FIG. 5are swapped, according to one embodiment of the inventive concept;

FIG. 8 is a block diagram for describing how a column address is swappedbased on a PCB, according to one embodiment of the inventive concept;

FIG. 9 is a block diagram for describing how control signals aretransmitted to counterpart dies through an interconnection partdescribed with reference to FIGS. 2 through 4, according to oneembodiment of the inventive concept;

FIG. 10 is a diagram schematically illustrating an application of theinventive concept applied to a memory system stacked throughthrough-silicon via, according to one embodiment of the inventiveconcept;

FIG. 11 is a diagram showing an application of the inventive conceptapplied to an electronic system, according to one embodiment of theinventive concept;

FIG. 12 is a block diagram schematically illustrating an application ofthe inventive concept applied to a computing device, according to oneembodiment of the inventive concept;

FIG. 13 is a block diagram schematically illustrating an application ofthe inventive concept applied to a smart phone, according to oneembodiment of the inventive concept;

FIG. 14 is a block diagram schematically illustrating application of theinventive concept applied to a mobile device, according to oneembodiment of the inventive concept;

FIG. 15 is a block diagram schematically illustrating an application ofthe inventive concept applied to an optical I/O scheme, according to oneembodiment of the inventive concept;

FIG. 16 is a block diagram schematically illustrating an application ofthe inventive concept applied to a handheld multimedia device, accordingto one embodiment of the inventive concept;

FIG. 17 is a block diagram schematically illustrating an application ofthe inventive concept applied to a personal computer, according to oneembodiment of the inventive concept;

FIG. 18 is block diagram showing a modified embodiment of asemiconductor device shown in FIG. 1;

FIG. 19 is a block diagram schematically illustrating one of chips shownin FIG. 18, according to one embodiment of the inventive concept; and

FIG. 20 is a block diagram schematically illustrating a 2-channelsemiconductor device implemented with a mono die.

DETAILED DESCRIPTION

Embodiments will be described in detail with reference to theaccompanying drawings. The inventive concept, however, may be embodiedin various different forms, and should not be construed as being limitedonly to the illustrated embodiments. Accordingly, known processes,elements, and techniques are not described with respect to some of theembodiments of the inventive concept. Unless otherwise noted, likereference numerals denote like elements throughout the attached drawingsand written description, and thus descriptions will not be repeated. Inthe drawings, the sizes and relative sizes of layers and regions may beexaggerated for clarity.

It will be understood that, although the terms “first”, “second”,“third”, etc., may be used herein to describe various elements,components, regions, layers and/or sections, these elements, components,regions, layers and/or sections should not be limited by these terms.Unless the context indicates otherwise, these terms are only used todistinguish one element, component, region, layer or section fromanother region, layer or section, for example as a naming convention.Thus, a first element, component, region, layer or section discussedbelow could be termed a second element, component, region, layer orsection without departing from the teachings of the inventive concept.

Spatially relative terms, such as “beneath”, “below”, “lower”, “under”,“above”, “upper” and the like, may be used herein for ease ofdescription to describe one element or feature's relationship to anotherelement(s) or feature(s) as illustrated in the figures. It will beunderstood that the spatially relative terms are intended to encompassdifferent orientations of the device in use or operation in addition tothe orientation depicted in the figures. For example, if the device inthe figures is turned over, elements described as “below” or “beneath”or “under” other elements or features would then be oriented “above” theother elements or features. Thus, the exemplary terms “below” and“under” can encompass both an orientation of above and below. The devicemay be otherwise oriented (rotated 90 degrees or at other orientations)and the spatially relative descriptors used herein interpretedaccordingly. In addition, it will also be understood that when a layeris referred to as being “between” two layers, it can be the only layerbetween the two layers, or one or more intervening layers may also bepresent.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the inventiveconcept. As used herein, the singular forms “a”, “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“includes,” “including,” “comprises,” and/or “comprising,” when used inthis specification, specify the presence of stated features, integers,steps, operations, elements, and/or components, but do not preclude thepresence or addition of one or more other features, integers, steps,operations, elements, components, and/or groups thereof. As used herein,the term “and/or” includes any and all combinations of one or more ofthe associated listed items. Also, the term “exemplary” is intended torefer to an example or illustration.

It will be understood that when an element or layer is referred to asbeing “on”, “connected to”, “coupled to”, or “adjacent to” anotherelement or layer, it can be directly on, connected, coupled, or adjacentto the other element or layer, or intervening elements or layers may bepresent. In contrast, when an element is referred to as being “directlyon,” “directly connected to”, “directly coupled to”, or “immediatelyadjacent to” another element or layer, or as “contacting” anotherelement or layer, there are no intervening elements or layers present.

Terms such as “same,” “planar,” or “coplanar,” as used herein whenreferring to orientation, layout, location, shapes, sizes, amounts, orother measures do not necessarily mean an exactly identical orientation,layout, location, shape, size, amount, or other measure, but areintended to encompass nearly identical orientation, layout, location,shapes, sizes, amounts, or other measures within acceptable variationsthat may occur, for example, due to manufacturing processes. The term“substantially” may be used herein to reflect this meaning.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this inventive concept belongs. Itwill be further understood that terms, such as those defined in commonlyused dictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and/orthe present specification and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

Embodiments disclosed herein may include their complementaryembodiments. Note that details of certain known data access operationsand internal function circuits associated with a DRAM may be skipped.

FIG. 1 is a block diagram of a memory system according to an embodimentof the inventive concept.

Referring to FIG. 1, a memory system includes a controller 10 and asemiconductor device 300. The semiconductor device 300 is formed of twoor more dies.

The semiconductor device 300 at least includes first and second chips100 and 200, which are contained in a mono package. As described herein,a mono package refers to a semiconductor device including a plurality ofdies on a single package substrate (e.g., package substrate 400),wherein at least two of the dies are at the same height above thepackage substrate. For example, a mono package may include a pluralityof chips, each chip disposed at a first level above the packagesubstrate, so that the chips are horizontally adjacent to each other.The term “semiconductor device,” however, may also be used to generallyrefer to other items, such as a package-on-package device, or simply asemiconductor chip.

The controller 10 is connected to a host, such as a microprocessor.Receiving a data reading operation or a data writing operation from thehost, the controller 10 applies a read command or a write commandthrough first and second channels B1 and B2 to the semiconductor device300. The first channel B1 is a channel dedicated for the first chip 100,and the second channel B2 is a channel dedicated for the second chip200.

The first chip 100 receives a command, an address, and data through thefirst channel B1. The first chip 100 outputs data read from a memorycell through the first channel B1.

The second chip 200 receives a command, an address, and data through thesecond channel B2. The second chip 200 outputs data read from a memorycell through the second channel B2.

The first channel B1 and second channel B2 may be independent of eachother, such as physically separate from each other. As such, it may bepossible to send/receive commands, addresses, and/or data between thecontroller 10 and the first chip 100 at the same time assending/receiving commands, addresses, and/or data between thecontroller 10 and the second chip 200.

In one embodiment, the first chip 100 is a first die manufactured on awafer, and the second chip 200 is a second die manufactured on the samewafer or on another wafer.

In exemplary embodiments, a die may mean an individual chip manufacturedon a wafer. A plurality of dies before a sorting process may bemanufactured as individual chips on a wafer through varioussemiconductor fabrication processes. An oxidation process, aphotolithography process, a thin film process, an etch process, or a CMPprocess may be one of the various semiconductor fabrication processes.

As understood from the above description, one die becomes one chip, andtwo dies constitute a multi-channel semiconductor device. The two diesmay be formed of two chips, with one chip accessed for certain types ofsignals or types of accesses through one respective channel and theother chip accessed for the same types of signals or types of accessesthrough another respective channel. Some types of accesses that may beperformed through the first or second channels include, for example,read and write access requests. The multi-channel semiconductor devicemay be, for example, a multi-chip package, such as a mono package.

In one embodiment, included between the first and second chips 100 and200 in one package is an interconnection part that is used to transfersignals from one chip to another. In certain embodiments, theinterconnection part, also referred to as an interconnection circuit,may be fully formed, for example, through wire bonding of a packaginglevel after dies on the wafer are cut. However, the interconnection partmay be formed using other methods as well. This interconnection part maybe thought of as a third channel, that is not dedicated to one of thechips 100 or 200, as it is configured to transfer signals to both of thechips and between the chips from one to another. Thus, this channel maybe referred to herein as a non-dedicated channel or common channel. Itmay be used to transfer different types of signals from the types ofsignals passed through the first and second channels 100 and 200described above.

For example, if a reset signal is transmitted to the first chip 100through a signal line B3, it may also be passed from the first chip 100to the second chip 200 through an interconnection part. The signal lineB3 combined with the interconnection part may be considered to be thethird channel. One of the signal line B3 and the interconnection partmay also be referred to on its own as a third channel. As a result ofthe reset signal being transmitted through a third channel, the firstand second chips 100 and 200 may be reset.

In a similar manner, when an impedance calibration signal ZQ istransmitted to the first chip 100 through the signal line B3, ZQ controlon the first and second chips 100 and 200 may be made based on the ZQsignal (e.g., through the interconnection part).

In FIG. 1, an embodiment of the inventive concept is exemplified as thesignal line B3 is disposed between the controller 10 and the first chip100. However, the inventive concept is not limited thereto. The signalline B3 may be disposed between the controller 10 and the second chip200. Also, the signal line B3 may be disposed between the controller 10and the first chip 100 and between the controller 10 and the second chip200.

In one embodiment, when the first chip 100 has a 4-Gbit memory capacity,the second chip 200 also has a 4-Gbit memory capacity. Hence, a2-channel semiconductor device has an 8-Gbit memory capacity. In certainembodiments, the two chips 100 and 200 may have the same physical sizeas well.

As such, a 2-channel semiconductor device with an 8-Gbit memory capacitymay be implemented with two dies, not one die, thereby making itpossible to prevent a decrease in density on a wafer and improvingavailability on edge dies. Similar implementations can be made withother sized memory capacity chips, such as two 16-Gbit chips combinedinto a 32-Gbit, 2-channel semiconductor package. As a result, anincrease in production cost may be alleviated due to an increase inyield.

In FIG. 1, an embodiment of the inventive concept is exemplified as thefirst and second chips 100 and 200 are contained in a mono package.However, the inventive concept is not limited thereto. For example, a4-channel semiconductor device can be implemented by putting four chipsin the mono package, and an 8-channel semiconductor device can beimplemented by putting eight chips in the mono package.

In an exemplary embodiment, each of the first and second chips 100 and200 may be a DDR4 DRAM which includes a plurality of memory cells eachformed of an access transistor and a storage capacitor.

FIG. 2 is a block diagram schematically illustrating a semiconductordevice shown in FIG. 1, according to certain exemplary embodiments.

Referring to FIG. 2, a semiconductor device contained in one packageincludes a first die 100 acting as a first chip of a first channel CH-A,a second die 200 acting as a second chip of a second channel CH-B, andan interconnection part 150 to transmit signals between the two,counterpart chips.

The second channel CH-B is independent of the first channel CH-A. Forexample, the first channel CH-A may include a first set of pads on thepackage substrate 400 and a first set of pads on the first die 100, andthe second channel CH-B may include a second set of pads on the packagesubstrate 400 and a first set of pads on the second die 200. In oneembodiment, the second die 200 has the same storage capacity andphysical size as the first die 100. For example, the first die 100 andsecond die 200 may have the same area when viewed from an overhead view.

In one embodiment, the first and second dies 100 and 200 are disposed ina mono package, such as described in connection with FIG. 1. The firstand second dies 100 and 200 may be positioned with a space therebetween,so that one edge of one die faces one edge of the other die. Also, sideedges of the dies may be aligned with each other.

The interconnection part 150 is positioned between the first die 100 andthe second die 200 to transmit certain types of signals, such as a resetsignal or a ZQ signal to opposite dies. In one embodiment, theinterconnection part 150 includes certain terminals on each of the firstdie 100 and second die 200 and terminals on a package substrate, andthus the interconnection part 150 is part of the mono package. Forexample, the interconnection part 150 may include pads on the first andsecond dies 100 and 200, conductive lines connected to the pads (e.g.,wire bonded wires, or through substrate vias), pads on the packagesubstrate 400 connected to the conductive lines, and internal wiring inthe package substrate 400 connected from one set of pads to another setof pads of the package substrate 400. Alternatively, the first die 100and second die 200 may each be flip-chip bonded to the package substrate400, which includes conductive lines therein connecting between firstpads that connect to terminals of the first die 100 and second pads thatconnect to terminals of the second die 200. The different lines withinthe interconnection part 150 may be connected to an external signal padon the package substrate 400 through the first die 100 and/or the seconddie 200. For example, for certain types of signals, the signal may bereceived at one of the first or second die 100 or 200 through a pad onthe package substrate 400, may pass through (and be used by) the chip100 or 200 that receives the signal, and then be transmitted to theother chip 200 or 100 through the above-mentioned interconnection part150 to be used by the other chip 200 or 100.

In FIG. 2, in one embodiment, when the first and second dies 100 and 200are disposed in the package, the second die 200 rotated through by 180degrees with respect to the first die is arranged in a rotated dieshape. For example, if the first and second dies 100 and 200 arefabricated at the same wafer, one chip separated from the wafer may formthe first die 100, and any other chip separated from the wafer may formthe second die 200 rotated by 180 degrees. In the event that processreproducibility is over a predetermined level, the first and second dies100 and 200 may be the same dies that are fabricated at differentwafers.

In one embodiment, a first channel is formed between the first die 100and the package substrate 400 through a first pad part 310 that isdisposed at a top of the package substrate 400 (when viewed from a planview).

In one embodiment, a second channel is formed between the second die 200and the package substrate 400 through a second pad part 320 that isdisposed at a bottom of the package substrate 400 (when viewed from aplan view).

As compared with FIG. 20 showing a 2-channel semiconductor deviceimplemented with a mono die (e.g., a single die), a 2-channelsemiconductor device implemented with two dies as illustrated in FIG. 2prevents a decrease in density on a wafer and improves availability ofconnection terminals on edges of dies.

FIG. 20 is a block diagram schematically illustrating a 2-channelsemiconductor device implemented with a mono die.

Referring to FIG. 20, a semiconductor device includes a mono die 102. Afirst channel chip portion 102A and a second channel chip portion 102Bare formed at the mono die 102. Because a 2-channel semiconductor deviceis implemented with a single die, the mono die 102 acts as a shared dieof the 2-channel semiconductor device.

The first channel chip portion 102A connects to a package substratethrough a first channel that connects to a first channel pad part 311,and the second channel chip portion 102B connects to a package substratethrough a second channel that connects to a second channel pad part 321.

If semiconductor devices shown in FIGS. 2 and 20 have the same memorycapacity, the size of the mono die 102 shown in FIG. 20 may be N-times(N being an integer of 2 or more) greater than that of a first die 100or a second die 200 shown in FIG. 2. As compared with the storage deviceshown in FIG. 2, the semiconductor device shown in FIG. 20 causes adecrease in density on a wafer and a decrease in availability ofconnection terminals on edges of dies. This may mean that the productioncost increases due to a decrease in yield.

FIG. 3 is a block diagram schematically illustrating of a storage deviceaccording to another embodiment of the inventive concept.

Referring to FIG. 3, a semiconductor device that forms a packageincludes a first die 100 acting as a first chip that communicatesthrough a first channel CH-A, a second die 200 acting as a second chipthat communicates through a second channel CH-B, and an interconnectionpart 150 to transmit signals between counterpart chips.

The second channel CH-B is independent of the first channel. In oneembodiment, the second die 200 has the same storage capacity andphysical size as the first die 100. The first and second dies 100 and200 are disposed in a mono package.

The interconnection unit 150 is positioned between one side of the firstdie 100 and one side of the second die 200 to transmit certain types ofsignals, such as a reset signal or a ZQ signal to opposite dies. Theinterconnection part 150 may be part of a mono package including thefirst die 100, second die 200, and a package substrate 400 a. Forexample, the interconnection part 150 may include pads on the first andsecond dies 100 and 200, conductive lines connected to the pads (e.g.,wire bonded wires, or through substrate vias), pads on the packagesubstrate 400 a connected to the conductive lines, and internal wiringin the package substrate 400 a. Alternatively, the first die 100 andsecond die 200 may each be flip-chip bonded to the package substrate 400a, which includes conductive lines therein connecting between first padsthat connect to terminals of the first die 100 and second pads thatconnect to terminals of the second die 200.

As illustrated in FIG. 3, when the first and second dies 100 and 200 aredisposed in the package, the second die 200 shifted through by apredetermined distance in a longitudinal direction from the first die100 is arranged in a repeated die shape. For example, if the first andsecond dies 100 and 200 are fabricated at the same wafer, one chipseparated from the wafer is the first die 100, and any other chipseparated from the wafer is the second die 200 shifted by apredetermined distance. In the event that process reproducibility isabove a predetermined level, the first and second dies 100 and 200 maybe the same dies that are fabricated at different wafers.

In the embodiment of FIG. 3, the first die 100 is connected to a firstpad part 310 disposed at a left side of the package substrate 400 a(when viewed from a plan view) through a first channel.

The second die 200 is connected to a second pad part 320 disposed at aleft side of the package substrate 400 a (when viewed from a plan view)through a second channel.

FIG. 4 is a block diagram schematically illustrating a storage deviceaccording to still another embodiment of the inventive concept.

Referring to FIG. 4, a semiconductor device contained in one packageincludes a first die 100 acting as a first chip connected to a firstchannel CH-A, a second die 200 acting as a second chip connected to asecond channel CH-B, and an interconnection part 150 to transmit signalsbetween counterpart chips.

The second channel CH-B is independent of the first channel CH-A. In oneembodiment, the second die 200 has the same storage capacity andphysical size as the first die 100. The first and second dies 100 and200 are disposed in a mono package.

The interconnection part 150 is positioned between the first die 100 andthe second die 200 to transmit certain types of signals, such as a resetsignal or a ZQ signal, between the two dies. The interconnection part150 is formed to be part of the mono package.

In one embodiment, the first and second dies are line-symmetrical withrespect to a center line of a transversal direction to achieve a mirrordie shape and are disposed in the package. For example, if the first andsecond dies 100 and 200 are fabricated as different dies at differentwafers, one chip separated from a first wafer is the first die 100, andanother chip separated from a second wafer is the second die 200 that isdisposed in a line-symmetrical way.

The first die 100 is connected to a first channel through a first padpart 310 that is disposed at a top of the mono package (when viewed in aplan view).

The second die 200 is connected to a second channel through a second padpart 320 that is disposed at a bottom of the mono package (when viewedin a plan view).

FIG. 5 is a diagram showing a connection structure among die pads of asemiconductor device shown in FIG. 2, according to one exemplaryembodiment.

If a 2-channel semiconductor device is implemented as described withreference to FIG. 2, ordering of pads of the second die 200 are changeddue to rotation of 180 degrees. When the first and second dies 100 and200 are implemented with the same die, the second die 200 is rotated by180 degrees so as to be disposed to be opposite to the first die 100.Hence, when seen from a second die 200, data output pads DQ0 through DQ7are located at a right lower part of a figure, in reverse order.

Referring to a symbol ‘F’, when the first die 100 is rotated by 180degrees, the data output pads DQ0 through DQ7 shown at a left top partof a first die pad part 104 are located at the right lower part of asecond die pad part 204, in reverse order from left to right when viewedin a plan view.

Pads DQ0 through DQ7, CA0 through CA5, and DQ8 through DQ15 of the firstdie pad part 104 are sequentially disposed from a left end of a figure.Pads DQ0 through DQ7, CA0 through CA5, and DQ8 through DQ15 of thesecond die pad part 204 are sequentially disposed from a right end ofthe figure (e.g., when all are viewed from a plan view).

Thus, the first die pad part 104 includes pads DQ0 through DQ7, CA0through CA5, and DQ8 through DQ15 sequentially arranged from a left sideof the figure. As can be seen, the order of pads of the first die padpart 104 is equal to that of pads of the first channel pad part 310 inthe same direction. This may mean that die pad swapping is unnecessary.As such, a first swapping part 102 of the first die 100, which may beformed of certain internal wiring and circuitry, does not conduct diepad swapping in response to a swapping disable signal ENB.

However, the second die pad part 204 includes pads DQ15 through DQ8, CA5through CA0, and DQ7 through DQ0 sequentially arranged from a left sideof the figure. As such, the order of pads of the second die pad part 204is different from that of pads of the second channel pad part 320 in thesame direction (e.g., they are the reverse of each other).

A second swapping part 202 of the second die 200 conducts die padswapping in response to a swapping enable signal EN. For example, in oneembodiment, the data output pads DQ15 through DQ8 of the second die padpart 204 are respectively connected to the data output pads DQ0 throughDQ7 of the second channel pad part 320 and the data output pads DQ7through DQ0 of the second die pad part 204 are respectively connected tothe data output pads DQ8 through DQ15 of the second channel pad part320. Also, the column address pads CA5 through CA0 of the second die padpart 204 are cross coupled to the column address pads CA0 through CA5 ofthe second channel pad part 320. Therefore, signals received at the diepads 204 of the second die 200 are received in reverse order, and needto be swapped and reordered in order for the accurate signals to reachthe internal circuitry of the second die 200.

FIG. 6 is a block diagram for describing how output signals of FIG. 5are swapped, according to one exemplary embodiment.

Referring to FIG. 6, a data swapping part, which may include variouscircuit elements and may be referred to as a swapping circuit, swaps andreverses data output signals and includes first and second multiplexersM1 and M2. The data swapping part, also referred to as a data swappingcircuit, may be installed in a first swapping part/circuit 102 and/or asecond swapping part/circuit 202 shown in FIG. 5. In one embodiment, ifthe die 100 is identical to the die 200, the first swapping part 102 isthe same as the second swapping part 202, but in a different chip.

In one embodiment, when a swapping enable signal EN is in an activestate (e.g., has a high level), swapping occurs, such that the firstmultiplexer M1 switches ‘1B’ data received from or transmitted to thesecond chip 200 to data output pads DQ7 through DQ0 of the second diepad part 204. Receiving a low level through an inverter INV1, also basedon the swapping enable signal EN in an active state, swapping occurssuch that the second multiplexer M2 switches ‘0B’ data received from ortransmitted to the second chip 200 to data output pads DQ15 through DQ8.The ‘0B’ data means 8-bit data (0 through 7), and the ‘1B’ data means8-bit data (8 through 15).

As understood from the above description, the data swapping part shownin FIG. 6 conducts data swapping by the byte.

When the swapping enable signal EN has an inactive state, that is, a lowlevel, the first multiplexer M1 switches the ‘0B’ data into the dataoutput pads DQ0 through DQ7. Also, receiving a high level through theinverter INV1 (indicating an inactive state), the second multiplexer M2switches the ‘1B’ data into the data output pads DQ8 through DQ15. Thus,the ‘0B’ data and the ‘1B’ data is directly transferred to the dataoutput pads DQ0 through DQ7 without swapping of a byte units.

FIG. 7 is a block diagram for describing how column addresses of FIG. 5are swapped, according to one exemplary embodiment.

Referring to FIG. 7, an address swapping part, which may include variouscircuit elements, swaps a column address and includes a multiplexer M10.The address swapping part, also referred to as a swapping circuit, maybe installed in a first swapping part 102 and/or a second swapping part202 shown in FIG. 5.

Receiving a swapping enable signal EN with a high level (e.g., activestate), the multiplexer M10 swaps an input column address CA5 throughCA0 for an output column address CA0 through CA5. For example, the inputcolumn address signal CA5 is swapped for an output column address signalCA0, the input column address signal CA4 for an output column addresssignal CA1, etc.

FIG. 8 is a block diagram for describing how a column address is swappedbased on a printed circuit board (PCB), according to an alternativeembodiment.

Referring to FIG. 8, in one embodiment, input column address pads CA5through CA0 corresponding to ‘8a’ and output column address pads CA0through CA5 corresponding to ‘8b’ are cross coupled through a PCBpattern or bonding wires.

With the PCB-based swapping scheme, an input column address CA5 throughCA0 is swapped for an output column address CA0 through CA5. Forexample, the input column address signal CA5 is connected to an outputcolumn address signal CA5, the input column address signal CA4 to anoutput column address signal CA4, etc. In this embodiment, an internaladdress swapping part such as shown in FIG. 7 need not be used.

It should be noted, that in different embodiments, such as shown in FIG.3 or 4, a swapping circuit may not be necessary. For example, in theseembodiments, the order of pads that connect to the pads in the packagesubstrate may be the same as those package substrate pads, and so theneed for swapping signals may not be required.

FIG. 9 is a block diagram for describing how control signals aretransmitted to counterpart dies through an interconnection partdescribed with reference to FIGS. 2 through 4, according to certainembodiments.

Referring to FIG. 9, a first die 100 of a 2-channel semiconductor device300 includes a ZQ pad 103 and a reset pad 104, and a second die 200thereof includes a ZQ pad 207 and a reset pad 208.

The first die 100 further includes ZQ logic 107 and reset logic 108. InFIG. 9, an embodiment of the inventive concept is exemplified as thefirst die 100 includes the ZQ logic 107 and the reset logic 108.However, the inventive concept is not limited thereto. For example, thesecond die 200 may be implemented to include ZQ logic and reset logicinstead of the first die 100, such that external signals are first sentto the second die 200. Alternatively, certain logic may be included inboth the first die 100 and the second die 200.

Provided to the ZQ logic 107 is a ZQ signal that is applied to the ZQpad 103 of the first die 100. The ZQ logic 107 makes ZQ calibration onthe first die 100. The ZQ logic 107 provides the ZQ signal to the ZQ pad207 of the second die 200 through an interconnection part 150.Alternatively, if a separate ZQ logic is included on the second die 200,then a signal line from the ZQ pad 103 of the first die 100 may beadditionally connected to the interconnection part 150, which connectsto the ZQ logic on the second die 200, so that a ZQ signal can be sentthrough the first die 100 to the second die 200 to perform ZQcalibration.

Therefore, in one embodiment, the second die 200 (though not shown) alsoincludes ZQ logic, and using the ZQ logic, the second die 200 conductsZQ calibration on the second die 200 in response to the ZQ signaltransmitted through the interconnection part 150.

Provided to the reset logic 108 is a reset signal that is applied to thereset pad 104 of the first die 100. The reset logic 108 performs a resetoperation on the first die 100. The reset logic 108 provides the resetsignal to the reset pad 208 or reset logic of the second die 200 throughthe interconnection part 150.

The second die 200 performs a reset operation on the second die 200 inresponse to the reset signal transmitted through the interconnectionpart 150.

In one embodiment, a ZQ calibration signal may be applied to asemiconductor device after the reset signal is applied to thesemiconductor device. A result of the ZQ calibration may be used toadjust an on-resistance value and an on-die termination value of anoutput driver.

When an operation control signal such as a ZQ signal or a reset signalis applied through one die, the other die receives the operation controlsignal in common through the interconnection part 150. This may meanthat the dies are controlled together, for certain functions.

In FIG. 9, an embodiment of the inventive concept is exemplified as anoperation control signal is applied through the first die 100. However,the inventive concept is not limited thereto. For example, the operationcontrol signal may be applied to the first die 100 through the seconddie 200.

As described above, according to certain embodiments, certain firsttypes of signals (e.g., data, address, and command signals), can be sentto multiple chips in a multi-chip package (e.g., a mono-package) throughseparated, dedicated channels. For example, a first chip can have afirst set of pads that connect to a first respective set of pads on apackage substrate, and a second chip can have a second set of pads thatconnect to a second respective set of pads on the package substrate. Inaddition, certain types of signals (e.g., operational control signalssuch as a ZQ signal and reset signal) can be sent to the multiple chipsthrough a common, non-dedicated channel. For example, a semiconductordevice may receive a second type of signal different from a first typeof signal received independently by the chips of the semiconductordevice, and may apply the second type of signal to both the first memorychip and the second memory chip via a common, third channel.

In one embodiment, the common channel is a channel that connects from apackage substrate to a first chip, and then connects from the first chipto one or more additional chips through an interconnection circuit thatelectrically connects the first chip to the one or more additionalchips. The interconnection circuit may pass, for example, through thepackage substrate on which the chips are mounted.

FIG. 10 is a diagram schematically illustrating an application ofcertain aspects of the inventive concept applied to a memory systemstacked through through-silicon via (TSV).

Referring to FIG. 10, an interface chip 3010 is placed at the lowermostlayer, and memory chips 3100, 3200, 3300, and 3400 are placed over theinterface chip 3010. A gap between chips is connected through microbumps, and a chip itself is connected through through-silicon via (TSV)3500. For example, the number of chips stacked is 2 or more.

In FIG. 10, each of the memory chips 3100, 3200, 3300, and 3400 isimplemented with a multi-channel semiconductor device formed of two ormore dies as described with reference to FIG. 1, thereby improving yieldand reducing production cost.

FIG. 11 is a diagram showing an application of certain aspects of theinventive concept applied to an electronic system.

Referring to FIG. 11, a DRAM 3500, a central processing unit (CPU) 3150,and a user interface 3210 are connected through a system bus 3250.

If an electronic system is an electronic device such as a portableelectronic device, a separate interface may be connected with anexternal communication device. The communication device may include, forexample, the following: a DVD player, a computer, a set top box (STB), agame machine, and a digital camcorder.

A DRAM 3500 may be implemented such that two or more dies 3550 and 3551are contained in one package. For example, at least two of thesemiconductor chips in the DRAM may be connected to a package substratein the DRAM according to one of the configurations described above inconnection with FIGS. 1-9. In addition, the DRAM 3500 may be packagedaccording to any of a variety of different packaging technologies.Examples of such packaging technologies may include the following: PoP(Package on Package), Ball grid arrays (BGAs), Chip scale packages(CSPs), Plastic Leaded Chip Carrier (PLCC), Plastic Dual In-Line Package(PDIP), Die in Waffle Pack, Die in Wafer Form, Chip On Board (COB),Ceramic Dual In-Line Package (CERDIP), Plastic Metric Quad Flat Pack(MQFP), Small Outline (SOIC), Shrink Small Outline Package (SSOP), ThinSmall Outline (TSOP), Thin Quad Flatpack (TQFP), System In Package(SIP), Multi Chip Package (MCP), Wafer-level Fabricated Package (WFP),and Wafer-Level Processed Stack Package (WSP).

In FIG. 11, a flash memory may be further connected to the bus 3250.However, the inventive concept is not limited thereto. For example, avariety of nonvolatile storage devices may be used.

The nonvolatile storage may store data information having various dataformats, such as a text, a graphic, and a software code.

FIG. 12 is a block diagram schematically illustrating an application ofcertain aspects of the inventive concept applied to a computing device.

Referring to FIG. 12, a computing device includes a memory system 4500including a DRAM 4520 and a memory controller 4510. The computing devicemay include an electronic device such as an information processingdevice or a computer. For example, the computing device may furtherinclude a modem 4250, a CPU 4100, a

RAM 4200, and a user interface 4300 that are electrically connected to asystem bus 4250. Data processed by the CPU 4100 or data input from anexternal device may be stored in the memory system 4500.

The DRAM 4520 may be a DDR4 DRAM, and in one embodiment includes aninterconnection part as described with reference to FIG. 2 and is formedof two or more dies contained in a mono package, thereby improving yieldof fabrication and making it possible to reduce production cost of thecomputing device.

The computing device may be applied to an electronic device such as asolid state disk, a camera image sensor, an application chipset, and soon. For example, the memory system 4500 may be formed of a solid statedrive (SSD). In this case, the computing device may store mass data atthe memory system 4500 stably and reliably.

In one embodiment, the memory system 4500 is implemented with a devicesuch as described with reference to FIG. 1, thereby improvingperformance of the computing device. The memory controller 4510 sends acommand, an address, data, and other control signals to the DRAM 4520.

The CPU 4100 functions as a host and controls an overall operation ofthe computing device.

A host interface between the CPU 4100 and the memory controller 4510 mayinclude a variety of protocols for exchanging data between the memorycontroller 4510 and a host. The memory controller 4510 is configured tocommunicate with the host or an external device by means of at least oneof various protocols including the following: USB (Universal Serial Bus)protocol, MMC (multimedia card) protocol, PCI (peripheral componentinterconnection) protocol, PCI-E (PCI-express) protocol, ATA (AdvancedTechnology Attachment) protocol, Serial-ATA protocol, Parallel-ATAprotocol, SCSI (small computer small interface) protocol, ESDI (enhancedsmall disk interface) protocol, and IDE (Integrated Drive Electronics)protocol.

The device shown in FIG. 12 may be provided as one of various componentsof an electronic device, such as a computer, a ultra-mobile personalcomputer (UMPC), a digital picture player, a digital video recorder, adigital video player, storage forming a data center, a device fortransmitting and receiving information in a wireless environment, one ofvarious electronic devices constituting a home network, one of variouselectronic devices constituting a computer network, one of variouselectronic devices constituting a telematics network, a radio frequencyidentification (RFID) device, and one of various components constitutinga computing system.

FIG. 13 is a block diagram schematically illustrating an application ofcertain aspects of the inventive concept applied to a smart phone.

Referring to FIG. 13, there is illustrated a block diagram of a portabletelephone (e.g., a smart phone) including a multi-channel DRAM 515. Thesmart phone includes an antenna (ATN) 501, an analog front end block(AFE) 503, analog-to-digital converters (ADC1, ADC2) 505 and 519,digital-to-analog converters (DAC1, DAC2) 507 and 517, a baseband block(BBD) 509, a speaker (SPK) 521, a liquid crystal monitor (LCD) 523, amicrophone (MIK) 525, and an input key (KEY) 527.

The analog front end block 503 may be a circuit block that is formed ofan antenna switch, a band pass filter, various amplifiers, a poweramplifier, a phase locked loop, a voltage controlled oscillator, anorthogonal demodulator, an orthogonal modulator, etc. and transmits andreceives radio waves. The baseband block 509 includes a signalprocessing circuit (SGC) 511, a base band processor (BP) 513, and amulti-channel DRAM 515.

Below, an operation of the smart phone will be described with referenceto FIG. 13. When an image including voice and character information isreceived, a radio wave input from the antenna 501 is provided to theanalog-to-digital converter 505 through the analog front end block 503for waveform equalization and analog-to-digital conversion. An outputsignal of the analog-to-digital converter 505 is provided to the signalprocessing circuit 511 of the baseband block 509 for voice and imageprocessing. A voice signal is transferred to the speaker 521 through thedigital-to-analog converter 517, and an image signal is transferred tothe liquid crystal monitor 523.

In the event that a voice signal is generated, a signal input throughthe microphone 525 is provided to the signal processing circuit 511through the analog-to-digital converter 519 for voice processing. Anoutput of the signal processing circuit 511 is transferred from thedigital-to-analog converter 507 to the antenna 501 through the analogfront end block 503. In the event that character information isgenerated, a signal input from the input key 527 is provided to theantenna 501 through the baseband block 509, the digital-to-analogconverter 507, and the analog front end block 503.

In FIG. 13, the multi-channel DRAM 515 is implemented with amulti-channel semiconductor memory device having first and second diesas described with reference to FIG. 2. In one embodiment, themulti-channel DRAM 515 is accessed by the base band processor 513through a first channel and by an application processor (not shown)through a second channel. As such that one memory chip may be shared bytwo processors.

In FIG. 13, an embodiment of the inventive concept is exemplified as thesmart phone includes the multi-channel DRAM 515. However, the inventiveconcept is not limited thereto. In some cases, the multi-channel DRAMmay be replaced with a multi-channel MRAM.

A volatile semiconductor memory device, such as DRAM or SRAM, losescontents stored therein at power-off.

In contrast, a nonvolatile semiconductor memory device, such as amagnetic random access memory (MRAM), retains contents stored thereineven at power-off. The nonvolatile semiconductor memory device may beused to store data when data has to be maintained even at power failureor power-off.

When implemented with STT-MRAM (Spin transfer torque magneto resistiverandom access memory), a multi-channel memory device may includeadvantages of the MRAM along with advantages described with reference toFIG. 1.

An STT-MRAM cell is formed of an MTJ (Magnetic Tunnel Junction) elementand a selection transistor. The MTJ element contains a fixed layer, afree layer, and a tunnel layer formed between the fixed layer and thefree layer. A magnetization direction of the fixed layer is fixed, whilea magnetization direction of the free layer is opposite to or the sameas that of the fixed layer depending on a condition.

FIG. 14 is a block diagram schematically illustrating application ofcertain aspects of the inventive concept applied to a mobile device.

Referring to FIG. 14, a mobile device may be an electronic device suchas a notebook computer or a handheld electronic device and includes amicro processing unit (MPU) 1100, an interface unit 1300, a display1400, a DRAM 200, and a solid state drive 3000.

In some cases, the DRAM 2000, the MPU 1100, and the SSD 3000 areprovided in the form of package. This may mean that the DRAM 2000 andthe flash memory 3000 are embedded in the mobile device.

The DRAM 2000 is a memory that is implemented with two or more diesdescribed with reference to FIG. 1.

If the mobile device is a portable communications device, the interfaceunit 1300 may be connected to a modem and transceiver block which isconfigured to perform a communication data transmitting and receivingfunction and a data modulating and demodulating function.

The MPU 1100 controls an overall operation of the mobile device,depending on a given program.

The DRAM 2000 is connected to the MPU 1100 through a system bus andfunctions as a buffer memory or a main memory of the MPU 1100.

The flash memory 3000 includes a NOR or NAND flash memory to store massinformation.

The display 1400 is implemented with a liquid crystal having abacklight, a liquid crystal having an LED light source, or a touchscreen (e.g., OLED). The display 1400 may be an output device fordisplaying images (e.g., characters, numbers, pictures, etc.) in color.

There is described an embodiment in which the mobile device is a mobilecommunications device. In some cases, the mobile device may be used as asmart card by adding or removing components to or from the mobiledevice.

The mobile device may be connected to an external communication devicethrough a separate interface. The external communication device mayinclude, for example, the following: a DVD player, a computer, a set topbox (STB), a game machine, and a digital camcorder.

Although not shown in FIG. 14, the mobile device may further include thefollowing: an application chipset, a camera image processor (CIS), and amobile DRAM.

In FIG. 14, an embodiment of the inventive concept is exemplified as aflash memory is used. However, the inventive concept is not limitedthereto. For example, a variety of nonvolatile storages may be used.

The nonvolatile storage may store data information having various dataformats, such as a text, a graphic, a software code, and so on.

FIG. 15 is a block diagram schematically illustrating an application ofcertain aspects of the inventive concept applied to an optical I/Oscheme.

Referring to FIG. 15, a memory system 30 adopting a high-speed opticalinput/output scheme includes a chipset 40 as a controller and memorymodules 50 and 60 mounted on a PCB substrate 31. The memory modules 50and 60 are inserted in slots 35_1 and 35_2 installed on the PCBsubstrate 31, respectively. The memory module 50 includes a connector57, DRAM chips 55_1 through 55_n, an optical I/O input unit 51, and anoptical I/O output unit 53.

The optical I/O input unit 51 includes a photoelectric conversionelement (e.g., a photodiode) to convert an input optical signal into anelectrical signal. The electrical signal output from the photoelectricconversion element is received by the memory module 50. The optical I/Ooutput unit 53 includes an electro-photic conversion element (e.g., alaser diode) to convert an electrical signal output from the memorymodule 50 into an optical signal. In some cases, the optical I/O outputunit 53 further includes an optical modulator to modulate a signaloutput from a light source.

An optical cable 33 performs a role of optical communications betweenthe optical I/O input unit 51 of the memory module 50 and an opticaltransmission unit 41_1 of the chipset 40. The optical communications mayhave a bandwidth (e.g., more than score gigabits per second). The memorymodule 50 receives signals or data from signal lines 37 and 39 of thechipset 40 through the connector 57 and performs high-speed datacommunications with the chipset 40 through the optical cable 33.Meanwhile, resistors Rtm installed at lines 37 and 39 are terminationresistors.

In the memory system 30 with the optical input/output structure shown inFIG. 15, multi-channel DRAMs 55_1 through 55_n according to anembodiment of the inventive concept may be contained in one package.

Thus, the chipset 40 independently performs a data reading operation anda data writing operation through the multi-channel DRAMs 55_1 through55_n by the channel. In this case, when applied to one die, a resetsignal or a ZQ signal is applied to any other die through aninterconnection part, thereby making it possible to reduce productioncost without lowering performance of the memory system 30.

In the case that the memory system 30 of FIG. 15 is an SSD, themulti-channel DRAMs 55_1 through 55_n may be used as a user data buffer.

FIG. 16 is a block diagram schematically illustrating an application ofcertain aspects of the inventive concept applied to a handheldmultimedia device.

Referring to FIG. 16, a handheld multimedia device includes an AP 510, amemory device 520, a storage device 530, a communication module 540, acamera module 550, a display module 560, a touch panel module 570, and apower module 580.

The AP 510 performs a data processing function.

In FIG. 16, the memory device 520 is implemented with a device such asdescribed with reference to FIG. 1, thereby resulting in a decrease inproduction cost of the handheld multimedia device.

The communication module 540 connected to the AP 510 acts as a modemthat is configured to perform a communication data transmitting andreceiving function and a data modulating and demodulating function.

The storage device 530 includes a NOR or NAND flash memory to store massinformation.

The display module 560 is implemented with a liquid crystal having abacklight, a liquid crystal having an LED light source, or a touchscreen (e.g., OLED). The display module 560 may be an output device fordisplaying images (e.g., characters, numbers, pictures, etc.) in color.

The touch panel module 570 provides the AP 510 with a touch input solelyor together with the display module 560.

There is described an embodiment in which the handheld multimedia deviceis a mobile communications device. In some cases, the handheldmultimedia device may be used as a smart card by adding or removingcomponents to or from the mobile device.

The handheld multimedia device may be connected with an externalcommunication device through a separate interface. The externalcommunication device may include the following: a DVD player, acomputer, a set top box (STB), a game machine, and a digital camcorder.

The power module 580 performs power management of the mobile device. Asa result, power saving of the handheld multimedia device may be achievedif a PMIC scheme is applied to a system-on-chip.

The camera module 550 includes a camera image processor (CIS) and isconnected to the AP 510.

Although not shown in FIG. 16, the handheld multimedia device mayfurther include another application chipset or a mobile DRAM.

FIG. 17 is a block diagram schematically illustrating an application ofthe inventive concept applied to an electronic device such as a personalcomputer.

Referring to FIG. 17, a personal computer 700 includes a processor 720,a chipset 722, a data network 725, a bridge 735, a display 740,nonvolatile storage 760, a DRAM 770, a keyboard 736, a microphone 737, atouch unit 738, and a pointing device 739.

In FIG. 17, the DRAM 770 may be implemented with two or more dies asdescribed with reference to FIG. 2. For example, first and second diesmay be formed to have independent channels. The second die may be spacedapart from the first die such that the first and second die arecontained in one package.

An interconnection part is formed between the first and second dies totransmit signals to counterpart dies. The first and second diesinterconnected are contained in one package.

The chipset 722 provides the DRAM 770 with a command, an address, data,or any other control signals.

The processor 720 acts as a host and controls an overall operation ofthe personal computer 700.

A host interface between the processor 720 and the chipset 722 mayinclude a variety of protocols for data communications.

The nonvolatile storage 760 may be formed of EEPROM (ElectricallyErasable Programmable Read-Only Memory), flash memory, MRAM (MagneticRAM), STT-MRAM (Spin-Transfer Torque MRAM), CBRAM (Conductive bridgingRAM),

FeRAM (Ferroelectric RAM), PRAM (Phase change RAM) called OUM (OvonicUnified Memory), RRAM or ReRAM (Resistive RAM), nanotube RRAM, PoRAM(Polymer RAM), NFGM (Nano Floating Gate Memory), holographic memory,molecular electronics memory device), or insulator resistance changememory.

The personal computer device shown in FIG. 17 may be provided as one ofvarious components of an electronic device, such as a computer, aultra-mobile personal computer (UMPC), a workstation, a net-book, apersonal digital assistance (PDA), a portable computer (PC), a webtablet, a wireless phone, a mobile phone, a smart phone, a smarttelevision, a three-dimensional television, an e-book, a portablemultimedia player (PMP), a portable game console, a navigation device, ablack box, a digital camera, a digital multimedia broadcasting (DMB)player, a digital audio recorder, a digital audio player, a digitalpicture recorder, a digital picture player, a digital video recorder, adigital video player, storage as a data center, a device fortransmitting and receiving information in a wireless environment, one ofvarious electronic devices constituting a home network, one of variouselectronic devices constituting a computer network, one of variouselectronic devices constituting a telematics network, a radio frequencyidentification (RFID) device, or one of various components constitutinga computing system.

FIG. 18 is block diagram showing a modified embodiment of asemiconductor device shown in FIG. 1.

Referring to FIG. 18, a multi-channel semiconductor device 300 aincludes four chips 100, 200, 100-1, and 200-1 formed of four dies.

An interconnection is formed between a first chip 100 and a second chip200, and an interconnection is formed between a third chip 100-1 and afourth chip 200-1.

The multi-channel semiconductor device 300 a includes four channels in amono package.

The first chip 100 and the second chip 200 are formed of two dies, butthey may perform the same data input/output operation as a 2-channelsemiconductor memory device having the same memory size as the combinedfirst chip 100 and second chip 200, but fabricated as a mono die.

The third chip 100-1 and the fourth chip 200-1 are formed of two dies,but they may perform the same data input/output operation as a 2-channelsemiconductor memory device having the same memory size as the combinedthird chip 100-1 and fourth chip 200-1, but fabricated as a mono die.

FIG. 19 is a block diagram schematically illustrating one of chips shownin FIG. 18.

A first chip 100, for example, has a circuit block configured asillustrated in FIG. 19.

The first chip 100 contains a memory cell array 160, a sense amplifierand input/output circuit 158, an input/output buffer 162, a buffer 152,a row decoder 154, a column decoder 156, and a control circuit 151.

The memory cell array 160 includes DRAM memory cells each having anaccess transistor and a storage capacitor. The memory cells are arrangedin a matrix. In FIG. 19, an embodiment of the inventive concept isexemplified as the memory cell array 160 is divided into four banks.However, the inventive concept is not limited thereto. For example, thememory cell array 160 may be formed of one bank, two bank, or five ormore banks.

The control circuit 151 generates an internal control signal forcontrolling set operating modes, in response to an input of a controlsignal and an address.

The buffer 152 receives and buffers an address. In response to theinternal control signal, the buffer 152 provides a row address forselecting a row of the memory cell array 160 to the row decoder 154 anda column address for selecting a column of the memory cell array 160 tothe column decoder 156.

The buffer 152 receives and buffers a command. The control circuit 151decodes the command from the buffer 152.

The row decoder 154 decodes the row address in response to the internalcontrol signal. The row decoder 154 selects and drives word linesconnected with memory cells, depending on the decoded result.

The column decoder 17 decodes the column address in response to theinternal control signal. Column gating is made depending on the decodedcolumn address. Driven is a selected bit line of bit lines connectedwith memory cells as a result of the column gating.

The sense amplifier and input/output circuit 158 senses data stored at aselected memory cell by detecting a potential on a bit line of theselected memory cell.

The input/output buffer 162 buffers data that is output and input. At aread mode of operation, the input/output buffer 162 buffers data readout from the sense amplifier and input/output circuit 158 and outputsthe buffered data to a channel CHi. The channel CHi may correspond toone of the first through fourth channels described in connection withFIGS. 1-9 and 18 above.

While the inventive concept has been described with reference toexemplary embodiments, it will be apparent to those skilled in the artthat various changes and modifications may be made without departingfrom the spirit and scope of the present invention. Therefore, it shouldbe understood that the above embodiments are not limiting, butillustrative.

For example, an embodiment of the inventive concept is exemplified asfirst and second dies are contained in one package. In some cases, adetailed implementation may be changed by modifying, adding, or deletingcircuit components of figures without departing from the spirit andscope of the inventive concept. Also, the spirit and scope of thepresent invention may be described depending on a semiconductor deviceincluding a DRAM. However, the inventive concept is not limited thereto.For example, the inventive concept may be applied to other types ofsemiconductor memory devices.

What is claimed is:
 1. A dynamic random access memory (DRAM) package forcommunicating with an external device through two independent channels,the DRAM package comprising: a package substrate; a first DRAM dieconfigured to be connected to a first independent channel; a second DRAMdie, identical to the first DRAM die in physical size and storagecapacity, configured to be connected to a second independent channel;and an interconnection circuit configured to electrically connect thefirst and second DRAM dies for transmitting and receiving signalsbetween the first and second DRAM dies, wherein the first and the secondDRAM dies are packaged together in a package, wherein one of the firstDRAM die and the second DRAM die includes a first swapping circuitconfigured to change a signal order of address signals received from oneof the first independent channel and the second independent channel inresponse to a first swapping signal, and wherein the package isconfigured such that an impedance calibration signal is sent to thesecond DRAM die through the interconnection circuit when the impedancecalibration signal is generated in the first DRAM die.
 2. The DRAMpackage of claim 1, wherein the second DRAM die is rotated through 180degrees with respect to the first DRAM die on the package substrate. 3.The DRAM package of claim 1, wherein the address signals include anaddress 0 signal, an address 1 signal, an address 2 signal, an address 3signal, an address 4 signal, and an address 5 signal, and the firstswapping circuit is further configured to swap the address 5 signal ofthe address signals for the address 0 signal of the address signals inresponse to the first swapping signal.
 4. The DRAM package of claim 3,wherein the first swapping circuit is further configured to swap theaddress 4 signal of the address signals for the address 1 signal of theaddress signals in response to the first swapping signal.
 5. The DRAMpackage of claim 4, wherein the first swapping circuit is configured toswap all of the address 5 through address 0 signals of the addresssignals in response to the first swapping signal.
 6. The DRAM package ofclaim 5, wherein the interconnection circuit includes a wire bonding. 7.The DRAM package of claim 1, wherein the package is configured such thatthe other of the first DRAM die and the second DRAM die includes asecond swapping circuit configured to change a signal order of addresssignals received from the other of the first independent channel and thesecond independent channel in response to a second swapping signal. 8.The DRAM package of claim 7, wherein the package is further configuredsuch that the first swapping signal is enabled when the second swappingsignal is disabled, and the first swapping signal is disabled when thesecond swapping signal is enabled.
 9. A dynamic random access memory(DRAM) package for communicating with an external device through a firstchannel and a second channel, the DRAM package comprising: a packagesubstrate; a first pad part including first through sixth channeladdress pads of the first channel respectively receiving first throughsixth address signals of the first channel, the first pad part beingdisposed at a first edge of the package substrate; a second pad partincluding first through sixth channel address pads of the second channelrespectively receiving first through sixth address signals of the secondchannel, the second pad part being disposed at a second edge of thepackage substrate, the second edge being opposite to the first edge; afirst DRAM die disposed on the package substrate, the first DRAM dieincluding first through sixth die address pads of the first channelrespectively connected to the first through sixth channel address padsof the first channel; a second DRAM die identical to the first DRAM diein physical size and storage capacity and rotated by one hundred eightydegrees relative to the first DRAM die, the second DRAM die includingfirst through sixth die address pads of the second channel respectivelyconnected to the sixth through first channel address pads of the secondchannel; and an interconnection circuit configured to electricallyconnect the first and second DRAM dies, the interconnection circuitincluding at least one wire bonding through which an impedancecalibration signal is transmitted from the first DRAM die to the secondDRAM die, wherein the first and second DRAM dies are packaged togetherin the DRAM package, wherein the second DRAM die further includes aswapping circuit configured to receive the first through sixth addresssignals of the second channel through the sixth through first dieaddress pads of the second channel, and change a signal order of thefirst through sixth address signals of the second channel in response toa swapping signal, and wherein the impedance calibration signal isgenerated by the first DRAM die.
 10. The DRAM package of claim 9,wherein the first DRAM die further includes a ZQ pad, and wherein theimpedance calibration signal is made based on signal received at the ZQpad of the first DRAM die.
 11. The DRAM package of claim 9, wherein thefirst through sixth channel address pads of the first channel and thefirst through sixth channel address pads of the second channel aresubstantially line-symmetrical with respect to a center line of the DRAMpackage, and wherein the center line of the DRAM package is between thefirst edge and the second edge.
 12. The DRAM package of claim 9, whereinthe swapping circuit is further configured to swap the sixth addresssignal of the second channel for the first address signal of the secondaddress channel in response to the swapping signal.
 13. The DRAM packageof claim 12, wherein the swapping circuit is further configured to swapthe fifth address signal of the second channel for the second addresssignal of the second channel in response to the swapping signal.
 14. TheDRAM package of claim 13, wherein the swapping circuit is furtherconfigured to swap all of the sixth through first address signals of thesecond channel in response to the swapping signal.
 15. A dynamic randomaccess memory (DRAM) package for communicating with an external devicethrough a plurality of channels, the DRAM package comprising: a packagesubstrate; a first pad part including first through sixth channeladdress pads of a first channel of the plurality of channelsrespectively receiving first through sixth address signals of the firstchannel, the first pad part being disposed at a first edge of thepackage substrate; a second pad part including first through sixthchannel address pads of a second channel of the plurality of channelsrespectively receiving first through sixth address signals of the secondchannel, the second pad part being disposed at a second edge of thepackage substrate, the second edge being opposite to the first edge; athird pad part including first through sixth channel address pads of athird channel of the plurality of channels, the third pad part beingdisposed at the first edge of the package substrate; a fourth pad partincluding first through sixth channel address pads of a fourth channelof the plurality of channels, the fourth pad part being disposed at thesecond edge of the package substrate; a first DRAM die disposed on thepackage substrate, the first DRAM die including first through sixth dieaddress pads of the first channel respectively connected to the firstthrough sixth channel address pads of the first channel; a second DRAMdie identical to the first DRAM die in physical size and storagecapacity and rotated by one hundred eighty degrees relative to the firstDRAM die, the second DRAM die including first through sixth die addresspads of the second channel respectively connected to the sixth throughfirst channel address pads of the second channel, a third DRAM diedisposed on the package substrate and identical to the first DRAM die inphysical size and storage capacity, the third DRAM die including firstthrough sixth die address pads of the third channel respectivelyconnected to the first through sixth channel address pads of the thirdchannel; a fourth DRAM die identical to the first DRAM die in physicalsize and storage capacity and rotated by one hundred eighty degreesrelative to the third DRAM die, the fourth DRAM die including firstthrough sixth die address pads of the fourth channel respectivelyconnected to the sixth through first channel address pads of the fourthchannel; a first interconnection circuit configured to electricallyconnect the first and second DRAM dies, the first interconnectioncircuit including at least one wire bonding through which a firstimpedance calibration signal is transmitted; and a secondinterconnection circuit configured to electrically connect the third andfourth DRAM dies, the second interconnection circuit including at leastone wire bonding though which a second impedance calibration signal istransmitted, wherein the first through fourth DRAM dies are packagedtogether in the DRAM package, and wherein the second DRAM die furtherincludes a swapping circuit configured to receive the first throughsixth address signals of the second channel through the sixth throughfirst die address pads of the second channel, and change a signal orderof the first through sixth address signals of the second channel inresponse to a swapping signal.
 16. The DRAM package of claim 15, whereinthe first through sixth channel address pads of the first channel andthe first through sixth channel address pads of the second channel aresubstantially line-symmetrical with respect to a center line of the DRAMpackage, wherein the first through sixth channel address pads of thethird channel and the first through sixth channel address pads of thefourth channel are substantially line-symmetrical with respect to thecenter line, and wherein the center line is between the first edge andthe second edge.
 17. The DRAM package of claim 15, wherein the firstimpedance calibration signal is generated at the first DRAM die, andwherein the second impedance calibration signal is generated at thethird DRAM die.
 18. The DRAM package of claim 17, wherein the first DRAMdie further includes a first ZQ pad, wherein the third DRAM die furtherincludes a second ZQ pad, wherein the first impedance calibration signalis generated based on a first signal received at the first ZQ pad, andwherein the second impedance calibration signal is generated based on asecond signal received at the second ZQ pad.
 19. The DRAM package ofclaim 15, wherein the first pad part further includes first througheighth channel DQ pads of the first channel respectively receiving firstthrough eighth DQ signals of the first channel, wherein the second padpart further includes first through eighth channel DQ pads of the secondchannel respectively receiving first through eighth DQ signals of thesecond channel, wherein the third pad part further includes firstthrough eighth channel DQ pads of the third channel, wherein the fourthpad part further includes first through eighth channel DQ pads of thefourth channel, wherein the first DRAM die further includes firstthrough eighth die DQ pads of the first channel respectively connectedto the first through eighth channel DQ pads of the first channel,wherein the second DRAM die further includes first through eighth die DQpads of the second channel respectively connected to the eighth throughfirst DQ pads of the second channel, wherein the third DRAM die furtherincludes first through eighth die DQ pads of the third channelrespectively connected to the first through eighth channel DQ pads ofthe third channel, and wherein the fourth DRAM die further includesfirst through eighth die DQ pads of the fourth channel respectivelyconnected to the eighth through first channel DQ pads of the fourthchannel.
 20. The DRAM package of claim 15, wherein the swapping circuitis further configured to swap the sixth address signal of the secondchannel for the first address signal of the second channel in responseto the swapping signal.